Intel® Dynamic Application Loader (Intel® DAL) Developer Guide

Developer Guide

  • 10/27/2020
  • Public Content
Contents

Signing Process

The Intel® DAL Pack Tool signs on ACPs using a pre-production key which limits the usage of the ACPs to emulator and pre-production platforms only.
Pre-production platforms are not available to customers; they are available only inside Intel.
In order to load an Install Security Domain ACP in a production environment, the S-SD ACP must be signed by Intel.
The signing process is described below:
  1. OEM submits a Security Domain signing request to the relevant Intel business unit. The signing request includes the following:
    • Security Domain manifest file
    • Signature parameters file
    • Signing Request form. To download a template, click here
  2. Intel reviews the request, creates the final Install Security Domain ACP to be signed, and performs basic installation tests on a pre-production platform.
  3. Intel signs on the Install Security Domain ACP with the production key and performs basic installation tests on a production platform.
  4. Intel completes validation/audit on the production signed binary ACP and the hash value of the OEM public key.
  5. The Intel business unit delivers the production signed binary ACP and the hash value of the OEM public key to the OEM.

Product and Performance Information

1

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

Notice revision #20110804