• 07/14/2017
  • Public Content

System on Module Overview

The Intel® Joule™ platform is a system on module (SoM) and is available in multiple configurations that share the same footprint and interface connector placement. This enables accelerated product design by providing multiple levels of compute power, graphics, memory and communication options in a single common footprint that can scale with end-product requirements.
Intel® Joule™ Module Configurations
There are two configurations of the module.
CPU Clock
Graphic Clock
Memory and Storage
Intel Joule 550x module
1.5 GHz
300 GHz
3GB RAM and 8GB eMMC Flash
Intel Joule 570x module
1.7 GHZ; Turbo Boost up to 2.4 GHz
450 MHz base, 650 MHz Turbo
4GB RAM and 16GB eMMC Flash
Intel Joule Compute Module Feature Summary
System on Chip Address Bus Size Cache
14mm Intel® Atom™ Processor 64-bit (x86-64) 4MB L1
Quad-core: 4 core supporting 2 threads per core 2MB per core-pair
Type and speed
LPDDR4 (4 lanes, 3200 MT/sec)
Integrated Package on Package
Execution Units Open Graphics Libraries
12EUs (2x6) on 550x and 18EUs on 570x OpenGL 3.1ES, OpenGL 4.3, and OpenCL 2.0
HDMI Output
HDMI 1.4b
Type Supported
eMMC 5.0
Max eMMC speed of 400 MB/second
Camera connectors MIPI CSI specification Supported resolutions  
Module accepts Hirose* BM14B(0.8)-40DP-0.4V Two CSI2 D-PHY ports at 1.5 Gb/sec per lane Camera1 (13MP) Camera2 (5MP)
Data, clock, power, and GPIO on each connector Supports two simultaneous cameras    
Expansion Connector
Module to expansion board
Two, 2x50 pin connectors
Hirose Electric Co LTD* Part number DF40C-100DP-0.4V
Number of DMICs Number and Speed of I2S
2 One I2S at 9.6 MHz
Routed via expansion board connectors  
USB 3.0 compliant
1 Type-C OTG and 1 Host
USB3, Port 0 is dedicated to Type-C USB3, Port 1 is multiplexed with PCIe
Number of Ports/lanes Max Speed
1 port / 1 lane 5 Gb/s
Multiplexed with USB 3, Port 1  
5 ports (3 LPSS, 2 ISH as LPSS) 2 full and 1 half   2 ports, 5 chip selects
Master Mode; max 3.4 Mb/s Maximum rate of 115.2 kb/s for half speed and 3.6864 Mb/s maximum for full speed modes Up to 25 MHz
Number of ports
For SD Card interface
Wi-Fi* and Bluetooth®
Integrated wireless module Bands Standards Security   Dual mode, BT 4.2 Core
Intel® Dual Band Wireless - AC 8260 Dual Band MIMO 2x2 IEEE 8.02.11agn + ac,
BT 4.2 core
WPA, WPA2,WPS2, 802.11w, WMM, WMM-PS,WFD, Miracast, Passpoint Over 15 profiles supported
  2.4 and 5 GHz       WPA2, AES-CCMP encryption
Dual MHF4 connectors on module
Connection A1 is Wi-Fi* only while connection A2 services both BT and Wi-Fi*
Power Manager
Integrated PMIC
SoC specific PMIC
Not user programmable
See also: Domain Features for a different description of features.
Expansion Board Requirements
The Expansion Board Design Guide provides design recommendations for designing customer expansion boards. At a minimum, the following elements are required to enable successful module boot and operation.
Method for connecting module to expansion board
The module must be securely mounted to an expansion board in a method that maintains full engagement of the board-to-board interface connectors. See the Mechanical and Environmental topic for more information.
Method to provide +VSYS power to the module
The subject is covered in Power Delivery, Signaling and Reset.
Required strapping of module pins
These module pin strappings must be implemented for boot during rising edge of PMIC_PWRGOOD (J6, pin 33). See Power Good in Power Delivery, Signaling, and Reset for details and Boot Strap Signal Isolation for an example isolation circuit.
Signal Name
J6, pin 93
Internal 20k pull down
Must be Hi-z or pulled down to GND each time PMIC_PWRGOOD asserts
J7, pin 11
Internal 20k pull up
Must be Hi-z or pulled up to +VDD1 each time PMIC_PWRGOOD asserts
J7, pin 15
Internal 20k pull down
Must be Hi-z or pulled down to GND each time PMIC_PWRGOOD asserts
J7, pin 79
Internal 20k pull up
Must be Hi-z or pulled up to +VDD1 each time PMIC_PWRGOOD asserts
J7, pin 77
Internal 20k pull down
Must be Hi-z or pulled down to GND each time PMIC_PWRGOOD asserts
J6, pin 14
Internal 20k pull up
Must be Hi-z or pulled up to +VDD1 each time PMIC_PWRGOOD asserts
BIOS installed on the module
The module requires a Basic Input Output System (BIOS) code to be installed in the device firmware in order to complete the boot and initialization process. The reference configuration loaded during module production can be overwritten with either an updated, approved reference BIOS or a custom BIOS developed by other users, customers or partners.
Turning off the device during a BIOS update can cause data corruption and loss of functionality.
End-use equipment integrating the device has to be authorized as required by the U.S. Federal Communications Commission ("FCC") or it has to be operated in accordance with the FCC's rules on operation of unauthorized devices (47 C.F.R. § 2.805), including obtaining approval from any licensed spectrum operator, if the end-use equipment will use such operator's spectrum.
Expansion Board Recommendations
Power button
Connect an active low power button to J6 pin 9 to trigger a reset or to power cycle the board.
DnX button
Connect an active high (VDD1) signal to J6, pin 78 to initiate a Download and Execute routine that will update the BIOS via USB 2.0, port 0. This DnX button signal is the only way to initiate the Download and Execute update process.
Real time clock (RTC) backup power source
See the Clock Specifications section.
UART debugging
Include a method to access UART port 2 on the module during boot to collect debug information as this is the only way to access debug messages generated during the power on and boot sequences.
Optional - External EEPROM
An external EEPROM can be connected to I2C port 0 to hold a specific configuration of the multipurpose pins. Intel® does not provide a tool to populate the EEPROM device. If you decide to use an EEPROM device, consider an ST Microelectronics M24M02-DR* or equivalent. During boot, if the BIOS does not find an EEPROM device attached to I2C port 0, then the module will load the default configuration that is stored in BIOS.

Product and Performance Information


Performance varies by use, configuration and other factors. Learn more at www.Intel.com/PerformanceIndex.