• 07/14/2017
  • Public Content
Contents

Module Retention

The following recommendations outline the elements of a robust and electrically stable module mounting method:
 
  • Use mechanical techniques to maintain a 1.5 mm space between the module PCB and the expansion board.
  • Use conductive hardware to provide a ground path between the expansion board and the module thermal plate. The PCB should be using grounded studs.
  • Apply even force (0.1 newton-meter or 0.9 in-lbs, maximum) at each through-hole mounting locations (module inserts).
  • Thermal solutions that interface with the module thermal plate must be independently supported to prevent forces that can lift, twist, or crush the module during any movement-transition or vibration during actual, end-device use cases.
Module Mounting Reference Design
The following (reference only) images describe the surface mount threaded standoff used on the development kit expansion board.
 
Cross-section of development kit mounting hardware
Reference design for expansion board SMT threaded standoff

Product and Performance Information

1

Performance varies by use, configuration and other factors. Learn more at www.Intel.com/PerformanceIndex.