• 07/14/2017
  • Public Content
Contents

Module Retention

The following recommendations outline the elements of a robust and electrically stable module mounting method:
 
  • Use mechanical techniques to maintain a 1.5 mm space between the module PCB and the expansion board.
  • Use conductive hardware to provide a ground path between the expansion board and the module thermal plate. The PCB should be using grounded studs.
  • Apply even force (0.1 newton-meter or 0.9 in-lbs, maximum) at each through-hole mounting locations (module inserts).
  • Thermal solutions that interface with the module thermal plate must be independently supported to prevent forces that can lift, twist, or crush the module during any movement-transition or vibration during actual, end-device use cases.
Module Mounting Reference Design
The following (reference only) images describe the surface mount threaded standoff used on the development kit expansion board.
 
Cross-section of development kit mounting hardware
Reference design for expansion board SMT threaded standoff

Product and Performance Information

1

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

Notice revision #20110804