Thermal Control Methods
- Passive cooling solutions that rely solely on the module thermal plate are limited to applications where SoC power stays below 1.5 W at 25 °C ambient temperature.
- Solutions that include a passive heatsink acting as a heat exchanger between the module and the ambient environment can typically dissipate 2 W to 3 W at 25 °C ambient temperature.
- The highest performing passive designs will achieve up to 5 W of dissipation at 25 °C ambient temperature.
Thermal Control Method
Maximum Power Dissipated (W) at 25° C
Passive cooling (thermal plate only)
Passive cooling (typical heatsink)
Passive cooling (high performance)
- Very low power workloads (<1.5 W) can transfer thermal energy directly into their environment via the module’s thermal plate.
- Low to moderate workloads (1.5 W to 3 W) will require a larger surface area to dissipate heat
- Enclosures and heatsinks can be designed to encourage thermal convection (natural airflow) in moderate
- A powered fan can provide constant airflow across the thermal plate or heatsink.
- Module power can be varied to maintain module within an ideal thermal range.