In this invitation-only contest, undergraduate students worldwide compete to create innovative designs and to cultivate innovation, team work, and engineering practice. Projects are based on the latest generation of Intel® embedded hardware and software tools. After 16 years, the Embedded System Design Contest (ESDC) is now one of China's most high-profile collegiate STEM contests.

Details

Contest Requirements

Development of contest projects must be based on the following hardware:

  • UP Squared* Grove* IoT Development Kit (required)
  • Cyclone® V FPGA customized for the UP Squared* board (optional)
  • Intel® Movidius™ Neural Compute Stick (optional)

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Key Dates


  • March 21: Contest period begins and platform delivery by mail
  • May 31: Project topic submission and team member information registration due
  • June 30: Contest ends
  • July 1: Final reports submission deadline
  • July 10 - July 15: Regional appraisal
  • July 20 - July 25: Countrywide appraisal
  • July 2018: Final award ceremony

Details

Co-hosted by China Higher Education Department of Ministry of Education (MOE) and Personnel Department of Ministry of Industry and Information Technology (MIIT). Co-organized by Shanghai Municipal Education Commission and Shanghai Jiaotong University. Sponsored by Intel.