Temp Profile of Intel E7501 and P64H2

Temp Profile of Intel E7501 and P64H2

Dear All,

Anybody has SMT temperature data of Intel E7501 and P64H2 FC-BGA chips?

1) Peak withstand temperature and duration?
2) Reflow duration above 183 degree?

I'm encountering a process problem on these two BGA chips. After SMT process per normal temp profile, the BGA chips are demaged and die package has power-to-ground short circuit defect. From the die package resin, a cracking mark can be seen.

My temp profile is as
1) Reflow zone above 183C is about 100sec.
2) Reflow zone above 200C is about 40sec.
3) Max. peak temp is at 210.5C.

Please kindly post your advise to zhengjiong@celestix.com.

Thank you so much!


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For more complete information about compiler optimizations, see our Optimization Notice.

Greetings fromIntel Software NetworkSupport.

These forums are more focused on issues related to software development for Intel Architecture. Technical documentation for the Intel E7501 Chipset can be found on Intel's Developer Web Site at http://developer.intel.com/design/chipsets/e7501/ , and documentation for the Intel 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) is linked from http://developer.intel.com/design/chipsets/e7500/ .

If you require technical support, we would recommend that you contact the Intel Server Products support team via the support form located at http://supportmail.intel.com/scripts-emf/welcome.asp .


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Message Edited by intel.software.network.support on 12-01-2005 10:38 AM

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