The following recommendations outline the elements of a robust and electrically stable module mounting method:
- Use mechanical techniques to maintain a 1.5 mm space between the module PCB and the expansion board.
- Use conductive hardware to provide a ground path between the expansion board and the module thermal plate. The PCB should be using grounded studs.
- Apply even force (0.1 newton-meter or 0.9 in-lbs, maximum) at each through-hole mounting locations (module inserts).
- Thermal solutions that interface with the module thermal plate must be independently supported to prevent forces that can lift, twist, or crush the module during any movement-transition or vibration during actual, end-device use cases.
Module Mounting Reference Design
The following (reference only) images describe the surface mount threaded standoff used on the development kit expansion board.
Cross-section of development kit mounting hardware
Reference design for expansion board SMT threaded standoff