Heatsink Options

You have several options for cooling the Intel® Joule™ module based on the amount of work the module is doing.

The module thermal plate can dissipate workloads of less than 2 watts. A fan moving air across the thermal plate is recommended when not using a heatsink. See Reference Fan Mounting Block for a fan mounting plate that you can 3D print yourself from the included files. We recommend the Sunon* fan, Model# MC30100V2-000U-A99 fan or equivalent.

The Intel Joule module reference heatsink can be used for workloads under 4 watts. See Passive Heatsink Assembly for instructions.

For workloads above 4 watts, an active heatsink is recommended. See Fansink Assembly for installing a heatsink with an attached fan, a fansink. Or, you can install the Reference Fan Mounting Block with a fan to move air over the Passive Heatsink Assembly.

See the Thermal Management Guide for additional information about the module’s thermal considerations.

Custom Cooling Solutions

The following recommendations are made towards any custom cooling solutions you may design.

Passive cooling methods

  • Ensure the surface area of the cooling fins is appropriate for intended workload
  • Use thermal transfer material between the thermal plate and heatsink
  • Integrate the heatsink retention system with the module retention solution
  • Have the heatsink connected to electrical ground
  • Ensure solutions do not exert excessive force on the module

Active cooling methods

  • Create linear airflow paths to prevent recirculating heated air (thermal runaway)
  • Evaluate solutions for blower induced vibration of the module
  • Ensure incoming air is clean and that exhaust vents enable convection
For more complete information about compiler optimizations, see our Optimization Notice.