This datasheet outlines the technical features of the Intel® Joule™ platform which is a system on module (SoM) that combines high-performance computing and graphics with large memory and wireless connectivity in a tiny footprint.
This datasheet allows an experienced developer to create their own design using the Intel® Joule™ Compute Module. If you need more guidance, see the Expansion Board Design Guide for the Intel® Joule™ Compute Module. It explains the expansion board designed by Intel and how you can use it to design your own product, or design your own expansion board similar to the one Intel designed. For information specific to the expansion board, see the Expansion Board Hardware Guide for the Intel® Joule™ Compute Module.
The Intel®Joule™ Module's Expansion Board PCB routing is to be determined by the developer for their specific board stack-up. Intel guarantees impedance targets of 80-85 Ohms for differential pairs and 45 Ohms for single-ended pairs, both with a tolerance of +/- 12%. It is the responsibility of the developer and board manufacturer to design their board’s outer layers (micro-strip) and inner layers (strip-line) based on these impedances and their individual stack-ups. High speed differentials should be strip-line as much as possible and shielded by ground both above and beneath their routing layer for best EMI performance.
This datasheet provides the following information:
- System on Module (SoM) overview
- Power Delivery, Signaling, and Reset
- Graphics Specifications
- Clock Specifications
- Wireless Connectivity
- SD Card Interface
- Module Connectors
- MIPI CSI
- I2C Interfaces
- UART Specificaitons
- I2S Specifications
- GPIO Specifications
- Pulse Width Modulators
- Universal Serial Bus
Observe proper Electrostatic Discharge (ESD) best practices to protect the module, development kit and accessories. Best practices include keeping devices contained in protective bags and utilizing a grounded wrist strap when handling devices.