Intel App Show for Developers 27:New Packaging Options at AppUp

Intel App Show for Developers 27:New Packaging Options at AppUp

The Intel AppUp® developer portal is no longer available for submitting apps. For additional information, please read the following article: http://software.intel.com/en-us/articles/intel-appup-developer-updates.

New PC packaging and licensing options for AppUp submissions:  Bob Duffy talks with Intel Engineer Norm Chou about new features supported for apps submitted to AppUp. Norm walks us through new packaging options such as EXE installers and files, larger file size support, non-silent installs, and support for product keys. With all of these new features, Norm explains how more PC developers should find it easier and quicker to get their app submitted to AppUp.

Para obtener información más completa sobre las optimizaciones del compilador, consulte nuestro Aviso de optimización.