Article

Intel® Media SDK & Intel® Media Server Studio Historical Release Notes

Release Notes of Intel® Media SDK include important information, such as system requirements, what's new, feature table and known issues since the previous release.

作者: Liu, Mark (Intel) 最后更新时间: 2019/07/03 - 20:07
Article

Maximize TensorFlow* Performance on CPU: Considerations and Recommendations for Inference Workloads

This article will describe performance considerations for CPU inference using Intel® Optimization for TensorFlow*
作者: Nathan Greeneltch (Intel) 最后更新时间: 2019/07/31 - 12:11
Article

Performance and Agility with Big Data in a Containerized Environment

Big data analytics solution developers no longer need to choose between performance and agility.
作者: Michael G. (Intel) 最后更新时间: 2019/08/01 - 10:32
Article

在容器化环境中提升大数据的性能与灵活性

作者: Michael G. (Intel) 最后更新时间: 2019/07/04 - 11:02
Article

最大限度提升 CPU 上的 TensorFlow* 性能:推理工作负载的注意事项和建议

本文将介绍使用面向 TensorFlow 的英特尔® 优化* 进行 CPU 推理的性能注意事项
作者: Nathan Greeneltch (Intel) 最后更新时间: 2019/08/09 - 02:02
Article

Vector API Developer Program for Java* Software

This article introduces Vector API to Java* developers. It shows how to start using the API in Java programs, and provides examples of vector algorithms. It provides step-by-step details on how to build the Vector API and build Java applications using it. It provides the location for downloadable binaries for Project Panama binaries.
作者: Neil V. (Intel) 最后更新时间: 2019/10/15 - 15:30
Article

IDF'15 Webcast: Data Analytics and Machine Learning

This Technology Insight will demonstrate how to optimize data analytics and machine learning workloads for Intel® Architecture based data center platforms. Speaker: Pradeep Dubey Intel Fellow, Intel Labs Director, Parallel Computing Lab, Intel Corporation
作者: Mike P. (Intel) 最后更新时间: 2019/10/15 - 16:50
Article

Intel Solutions and Technologies for the Evolving Data Center

  One Stop for Optimizing Your Data Center From AI to Big Data to HPC: End-to-end Solutions
作者: 管理 最后更新时间: 2019/10/15 - 17:00
博客

Autodesk University Shows How Intel Technology Powers 3D Design & Engineering Software

At the Autodesk University event in Las Vegas, November 14-16, civil and commercial/industrial designers and manufacturers who use Autodesk software came together to see The Future of Making Things.
作者: Tim Allen. (Intel) 最后更新时间: 2019/10/15 - 18:32